X-Ray Orientation Analyzer

Introduction to X-Ray Orientation Analyzer: 

Automatic X-ray orientation instrument uses the principle of X-ray diffraction to accurately and quickly determine the cutting angle of natural and artificial single crystals (piezoelectric crystals, optical crystals, laser crystals, semiconductor crystals). Matching with the cutting machine, which can be used for the directional cutting of the above crystals. Automatic X-ray orientation instrument is an indispensable instrument for precision processing and manufacturing crystal devices. Automatic X-ray orientation instrument is widely used in the research, processing and manufacturing of crystal materials.

Advantages of X-Ray Orientation Analyzer:

X-Ray Orientation Analyzer TA sample table:

Designed according to the round bar crystal, the sample stage has a load-bearing track, which can measure 1~30 kg, 2~6 inches in diameter (can be increased to 8 inches), and a vacuum suction device on the sample stage. This type of goniometer measures the reference surface of a rod-shaped crystal and also measures the surface of a wafer.

X-Ray Orientation Analyzer TB sample table: 

Designed according to the round bar crystal, the sample stage is equipped with a load-bearing track and is equipped with a V-shaped support rail. It can measure an ingot with a weight of 1~30 kg, a diameter of 2~6 inches (can be increased to 8 inches) and a length of 500mm. A vacuum suction device is attached to the sample stage. This type of goniometer measures the end face of the rod crystal and also measures the surface of the wafer.

X-Ray Orientation Analyzer TC sample table:

It is mainly used for the detection of the outer circular reference surface of single wafers such as silicon and sapphire. The position of the X-ray receiving on the suction disk adopts an open design, which overcomes the problem that the suction disk blocks X-rays and misalignment, and satisfies different specifications. With the reference edge detection, the suction pump of the sample stage can suck the 2~8 inch wafer to make the detection more accurate.

X-Ray Orientation Analyzer TD sample table:

Mainly used for multi-point measurement of wafers such as silicon and sapphire. The wafer can be manually rotated on the sample stage, such as 0°, 90°, 180°, 270°, etc., to meet the special measurement needs of customers.

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