In the field of modern technology, many high-tech products—from smartphone screen substrates to core components of laser generators—rely on a fundamental material: synthetic single crystals. The precision of the cutting angle of these crystals directly determines the performance and yield of the final products. The X-Ray Orientation Analyzer is an indispensable instrument in the precision manufacturing of crystal devices. Utilizing the principle of X-ray diffraction, it accurately and rapidly measures the cutting angles of both natural and synthetic single crystals, including piezoelectric crystals, optical crystals, laser crystals, and semiconductor crystals. Dandong Tongda Science and Technology Co., Ltd. offers a range of reliable X-Ray Orientation Analyzers tailored to the research, processing, and manufacturing needs of the crystal materials industry. 01 Versatile Machine for Diverse Crystal Orientation Needs Dandong Tongda's X-Ray Orientation Analyzers primarily include models such as the TYX-200 and TYX-2H8. The TYX-200 model boasts a measurement accuracy of ±30″, with a digital display and a minimum reading of 10″. The TYX-2H8 model is an improved version of the TYX-200, featuring enhancements in the goniometer structure, load-bearing track, X-ray tube sleeve, support body, and an elevated sample stage. These improvements enable the TYX-2H8 to handle samples weighing 1–30 kg with diameters of 2–8 inches. It retains a digital angle display and a measurement accuracy of ±30″. 02 Advanced Technical Features for User-Friendly Operation Dandong Tongda's X-Ray Orientation Analyzers are designed with practicality and reliability in mind. Their user-friendly operation requires no specialized knowledge or advanced skills from the operator. The instrument features a digital angle display, ensuring intuitive and easy-to-read measurements while minimizing the risk of misreading. The display can be zeroed at any position, allowing direct reading of the wafer angle deviation. Some models are equipped with dual goniometers for simultaneous operation, significantly improving detection efficiency. A special integrator with peak amplification enhances measurement accuracy. The X-ray tube and high-voltage cable adopt an integrated design, improving high-voltage reliability. The detector high-voltage system uses a DC high-voltage module, and the vacuum suction sample stage further enhances measurement accuracy and speed. 03 Dedicated Sample Stage Designs for Various Testing Needs To meet the measurement requirements of samples with different shapes and sizes, Dandong Tongda offers a variety of specialized sample stages: TA Sample Stage: Designed for rod-shaped crystals, it features a load-bearing track and can test crystal rods weighing 1–30 kg with diameters of 2–6 inches (expandable to 8 inches). This stage can measure reference surfaces of rod-shaped crystals as well as surfaces of wafer-shaped crystals. TB Sample Stage: Also designed for rod-shaped crystals, it includes a load-bearing track and V-shaped support rails. It can test crystal rods weighing 1–30 kg, with diameters of 2–6 inches (expandable to 8 inches) and lengths of up to 500 mm. It measures end faces of rod-shaped crystals and surfaces of wafer-shaped crystals. TC Sample Stage: Primarily used for detecting the outer reference surfaces of single-crystal wafers such as silicon and sapphire. Its open-design suction plate avoids X-ray obstruction and positioning inaccuracies. The stage's suction pump securely holds wafers sized 2–8 inches, ensuring precise detection. ​ TD Sample Stage: Designed for multi-point measurements of wafers such as silicon and sapphire. Wafers can be manually rotated on the stage (e.g., 0°, 90°, 180°, 270°) to meet specific customer measurement needs. 04 High-Performance Model for Large Sample Challenges For large and challenging sample detection, Dandong Tongda's X-Ray Orientation Analyzers demonstrate exceptional performance. The TYX-2H8 model, for example, is particularly suitable for orienting sapphire crystal ingots and rods. This instrument supports measurements of sapphire A, C, M, and R crystal orientations, with an adjustable measurement range of 0–45° via electric automation. Its technical specifications are impressive: Copper-target X-ray tube with grounded anode and forced air cooling. Adjustable tube current: 0–4 mA; tube voltage: 30 kV. Operation via computer or touchscreen control. Synchronized movement of the X-ray tube and detector; electric-driven rotary table. Total power consumption: ≤2 kW. Most notably, its sample handling capacity includes crystal ingots weighing up to 30–180 kg, with maximum dimensions of 350 mm in diameter and 480 mm in length. These capabilities make it suitable for large sample detection in most industrial scenarios. 05 Broad Applications Supporting Multiple Industries Dandong Tongda's X-Ray Orientation Analyzers are widely used across various industries involved in the research, processing, and manufacturing of crystal materials. In the semiconductor industry, they enable precise orientation cutting of silicon wafers. In the optoelectronics field, they are used for precision processing of sapphire substrates, optical crystals, and laser crystals. In the piezoelectric materials sector, they ensure accurate cutting angle measurements for stable end-product performance. The instruments are particularly well-suited for sapphire materials, which are in high demand due to their hardness, high light transmittance, and excellent physicochemical stability. Sapphire is widely used in LED substrates, consumer electronic screens, and optical windows. Dandong Tongda's X-Ray Orientation Analyzers have become essential tools in China's crystal material research and manufacturing fields, thanks to their reliable performance, diverse configurations, and strong adaptability. Their modular design and variety of sample stage options allow users to select configurations that meet specific needs, ensuring high detection accuracy while improving work efficiency. Whether for research institutions or manufacturing quality control and process optimization, these instruments provide robust technical support, empowering users to achieve breakthroughs in precision manufacturing.

The automatic X-ray orientation instrument is a device that uses the diffraction principle of X-ray to determine the crystal structure, orientation, and lattice parameters. It has a wide range of applications in materials science, geology, physics, and chemistry, especially in studying the microstructure and properties of single crystal, polycrystalline materials, and thin film materials. The following will provide a detailed introduction to the working principle, application, and operational precautions of the X-ray crystal orienter. With the advancement of technology, the automatic X-ray orientation instrument devices continues to improve, with higher resolution and easier operation. At the same time, the combination with other analytical techniques such as electron microscopy and spectroscopic analysis makes the analysis of crystal structure more comprehensive and in-depth. In addition, portable and online monitoring X-ray orientation analyzer devices have gradually developed, providing possibilities for on-site analysis and real-time monitoring. In summary, X-ray orientation analyzer is a powerful analytical tool that is crucial for understanding and controlling the microstructure of materials. With the continuous development of technology, its application in various fields will become more extensive and in-depth.

The X-ray orientation analyzer is a device that uses the principle of X-ray diffraction to determine crystal orientation. It is widely used in fields such as materials science, geology, physics, etc., for studying crystal structure, lattice parameters, crystal defects, etc. The working principle of an X-ray orientation analyzer​ is to irradiate a monochromatic X-ray beam onto the crystal under test. When the X-ray interacts with atoms in the crystal, scattering occurs. According to Bragg's law, when the wavelength of X-rays is an integer multiple of the atomic spacing in a crystal, scattered light will interfere and form a series of alternating bright and dark stripes, known as Bragg reflection. By measuring the angles and intensities of these Bragg reflections, information such as crystal orientation and lattice parameters can be calculated. The X-ray orientation analyzer usually includes the following main parts: 1.X-ray source: a device that produces monochromatic X-rays, typically using an X-ray tube or synchrotron radiation source. 2.Sample stage: a platform used to place the crystal to be tested, which can adjust the position and angle of the crystal. 3.Detector: used to receive scattered X-rays and convert them into electrical signals. Common detectors include scintillation counters, proportional counters, etc. 4.Data acquisition and processing system: used to collect signals output by detectors, and perform data processing and analysis. Usually includes multi-channel analyzers, computers, and other equipment. 5.Control system: used to control the movement of X-ray source, sample stage, and detector to achieve measurement of crystals in different directions. By using an X-ray orientation analyzer, researchers can accurately determine the orientation and lattice parameters of crystals, thereby gaining a deeper understanding of their structure and properties. This is of great significance for the development of new materials, geological exploration, crystal growth and other fields.

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XRD technology plays an important role in the research and development of ceramic materials. It provides a reliable scientific basis for the synthesis, preparation process optimization, performance improvement and application popularization of ceramic materials.

Automatic X-ray orientation instrument is an indispensable instrument for precision processing and manufacturing crystal devices. It is widely used in the research, processing and manufacturing of crystal materials.

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Using the principle of X-ray diffraction, the cutting Angle of natural and artificial single crystals is accurately and quickly determined, and the cutting machine is equipped for directional cutting of the said crystals.